THT Solder Adapter & Screwdown Aluminum Test Sockel 0.30mm pitch
BEJxxxx-04Ex-xxxxxx55Lx
Test Socket for BGA – Bumped chip – WLCSP – eMMC Package Clamshell Alu (> 200 contacts) Elastomer Solderless Compression
Zusätzliche Informationen
| Anzahl Kontakte | Bis 200 |
|---|---|
| Typ | SMT |
| Anschlussart | Sockel |
| Bauform | 874 |
| Material | Aluminum Shell |
| Kontakt Material | Gold |
| Wasserdicht | Nein |
| Raster | 0.30mm |